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Boriding of Binary Ni-Ti and Ternary Ni-Ti-Cu Shape Memory Alloys

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dc.creator UÇAR, Nazım
dc.creator TURKU, Nursen
dc.creator OZDEMIR, Ahmet Faruk
dc.creator CALIK, ADNAN
dc.date 2016-06-30T21:00:00Z
dc.date.accessioned 2020-10-06T09:35:30Z
dc.date.available 2020-10-06T09:35:30Z
dc.identifier 25ec5ae3-c3ed-4407-9889-dfebd049e1be
dc.identifier 10.12693/aphyspola.130.492
dc.identifier https://avesis.sdu.edu.tr/publication/details/25ec5ae3-c3ed-4407-9889-dfebd049e1be/oai
dc.identifier.uri http://acikerisim.sdu.edu.tr/xmlui/handle/123456789/55675
dc.description In this work, the boriding of binary (Ni-Ti) and ternary (Ni-Ti-Cu) shape memory alloys was carried out in a solid medium at 1173 K for 8 h using the powder pack method with Ekabor-Ni powders. Characterization of boride layer formed on the surface of alloys was identified by optical microscopy and scanning electron microscopy. TiB2, NiB2 and SiC phases in the boride layer of borided binary (Ni-Ti) and ternary (Ni-Ti-Cu) shape memory alloys was confirmed by X-ray diffraction analysis. The microhardness and thickness of the boride layers were measured. The obtained hardness values show a hardness anomaly due to porosity and structural defects with increase of Cu content, while a decrease in the value of hardness moving from the boride layer to main structure was observed.
dc.language eng
dc.rights info:eu-repo/semantics/closedAccess
dc.title Boriding of Binary Ni-Ti and Ternary Ni-Ti-Cu Shape Memory Alloys
dc.type info:eu-repo/semantics/article


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