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Diffusion Kinetics of Binary Ti-Ni Shape Memory Alloys

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dc.creator Karakas, S.
dc.creator UÇAR, Nazım
dc.creator CALIK, ADNAN
dc.creator DOGAN, Sule
dc.creator OZDEMIR, Ahmet Faruk
dc.date 2017-08-31T21:00:00Z
dc.date.accessioned 2020-10-06T11:25:26Z
dc.date.available 2020-10-06T11:25:26Z
dc.identifier d8e24e0f-e280-43d9-abd9-a628fef5826c
dc.identifier 10.12693/aphyspola.132.524
dc.identifier https://avesis.sdu.edu.tr/publication/details/d8e24e0f-e280-43d9-abd9-a628fef5826c/oai
dc.identifier.uri http://acikerisim.sdu.edu.tr/xmlui/handle/123456789/73447
dc.description In this work, the boriding of binary Ti-Ni shape memory alloys was carried out in a solid medium at 1173 and 1273 K for 2, 4, and 8 h using the powder pack method with Ekabor-Ni powders. The boride layer was characterized by optical microscopy and scanning electron microscopy. The obtained results show that boride layer thickness increases with the increasing boriding temperature and time. Depending on temperature and boride layer thickness, the diffusion process is thermally activated, with the mean value of the activation energy being close to 67 kJ/mol.
dc.language eng
dc.rights info:eu-repo/semantics/closedAccess
dc.title Diffusion Kinetics of Binary Ti-Ni Shape Memory Alloys
dc.type info:eu-repo/semantics/article


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