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Effect of High Frequency Ultrasonic Agitation on the Bond Strength of Self-etching Adhesives

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dc.creator Lassila, Lippo V. J.
dc.creator Vallittu, Pekka K.
dc.creator Bagis, Bora
dc.creator Turkaslan, Suha
dc.date 2009-01-01T01:00:00Z
dc.date.accessioned 2021-12-03T12:03:43Z
dc.date.available 2021-12-03T12:03:43Z
dc.identifier dcc8ddc5-5b33-4abe-bcc1-676372b7b59c
dc.identifier 10.3290/j.jad.a17629
dc.identifier https://avesis.sdu.edu.tr/publication/details/dcc8ddc5-5b33-4abe-bcc1-676372b7b59c/oai
dc.identifier.uri http://acikerisim.sdu.edu.tr/xmlui/handle/123456789/95303
dc.description Purpose: To investigate the effect of high frequency ultrasonic agitation on the microtensile bond strengths of different self-etching adhesives.
dc.language eng
dc.rights info:eu-repo/semantics/closedAccess
dc.title Effect of High Frequency Ultrasonic Agitation on the Bond Strength of Self-etching Adhesives
dc.type info:eu-repo/semantics/article


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